fig5

Heterostructure-governed mechanisms for synergistic improvement of strength and conductivity in copper alloys

Figure 5. Processing methods for forming grain gradient structure. (A) SMGT[67]. (Reprinted from Ref.[67], with permission from Elsevier). (B) Surface rotational rolling[72]. (Reprinted from Ref.[72], with permission from Elsevier). (C) Single-roll angular rolling[74]. (Quoted with permission from Lee et al.[74], under the CC BY license, http://creativecommons.org/licenses/by/4.0/). (D) Rotary swaging[76]. (Reprinted from Ref.[76], with permission from Elsevier). (E) High-pressure torsion[79]. (Reprinted from Ref.[79], with permission from Elsevier). (F) Direct-current electrodeposition[80]. (Reprinted from Ref.[80], with permission from Elsevier).

Microstructures
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