fig3

Heterostructure-governed mechanisms for synergistic improvement of strength and conductivity in copper alloys

Figure 3. Plastic response of heterogeneous structures. (A) Density of GNDs in copper near the copper-bronze interfaces as measured using electron backscatter diffraction (EBSD)[51]. (Reprinted from Ref.[51], with permission from Elsevier). (B) The schematic of the unloading-reloading loop for defining the unload yielding σu, reload yielding σr, back stress σb and frictional stress σf, effective unloading Young’s modulus of Eu, and effective reloading Young’s modulus of Er[29]. (Quoted with permission from Yang et al.[29], under the CC BY license, http://creativecommons.org/licenses/by/4.0/).

Microstructures
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